Use LEFT and RIGHT arrow keys to navigate between flashcards;
Use UP and DOWN arrow keys to flip the card;
H to show hint;
A reads text to speech;
57 Cards in this Set
- Front
- Back
DDR |
Double Data Rate. Doubled the throughput of SDRAM by making 2 processes for every clock cycle. 184-pin DIMMS for desktop. 200-pin SO-DIMM or 172-pin micro-DIMM for Laptops |
|
DIMM |
Dual In-Line Memory Module Function: A size of RAM stick typically used in desktop computers and servers |
|
SODIMM |
Small Outline Dual In-Line Memory Module Function: A size of RAM stick typically used in laptop computers. |
|
Parity |
Function: Parity RAM has the ability to detect memory-based data errors, while non-parity RAM does not. Largely made obsolete by ECC RAM |
|
ECC RAM |
Error-Correcting Code RAM Function: Can both detect AND correct memory-based data errors. Commonly used in ciritcal servers. More expensive and requires expensive ECC-supporting motherboards and processors. |
|
Buffered |
Buffered RAM places less load on a systems memory controller. Used when a lot of RAM is installed in a machine, as with high-performance servers. Regular workstations usually have unbuffered RAM installed. |
|
Single-Sided RAM |
All of the RAM chips are on one side of the RAM module. Single-Sided is newer than Double-Sided RAM. |
|
Double-Sided RAM |
The RAM chips are on both sides of the RAM module. Older than Single-Sided RAM. |
|
RAM Channels |
The level of communication between RAM modules and the system's memory controller. The greater the # of channels, the more RAM modules the memory controller can access. |
|
Dual-Channel |
The motherboard has 2 RAM sockets that work together to increase throughput. Needs 2 identical RAM modules installed for dual-channel to work. Most standard PCs are dual-channel. |
|
Triple-Channel |
Motherboard has 3 RAM sockets (or a multiple of 3) working together to increase throughput. Requires a certain model of CPU(like Core i7) Expensive. Usually used for high-performance servers and workstations. |
|
Quad-Channel |
Motherboard has 4 RAM sockets(or a multiple of 4) working together to increase throughput. Expensive. Usually used for high-performance servers and workstations. |
|
RAM |
Random Access Memory. A form of computer data storage which stores frequently used program instructions to increase the general speed of a system. |
|
DRAM |
Dynamic Random Access Memory. A type of RAM that stores each bit of data in a separate capacitor within an integrated circuit. Dynamic means it will lose the data when power is cut off. As opposed to Static. |
|
SDRAM |
Synchronous DRAM. Same as DRAM, but it is synchronous. Meaning it is tied to the system clock, just like the CPU and MCC, so the MCC knows when data is ready to be grabbed. Most common size was the 168-pin desktop variety. |
|
RDRAM |
Rambus DRAM. Could handle speeds up to 800 MHz. A stick of RDRAM was called RIMM. Didn't take off and was eventually abandoned. |
|
DDR2 RAM |
2nd Generation of DDR RAM. Doubled the input/output circuits while using less power. 240-pin DIMM. 200-pin SO-DIMM. |
|
DDR3 RAM |
3rd Generation of DDR RAM. Higher speeds, with lower power consumption. 240-pin DIMM, like DDR2, but slotted differently so they can not be mixed. 204-pin SO-DIMM. |
|
XMP or Extended Memory Profile |
Feature on some DDR3 RAM modules that enable power users to overclock their RAM easily; boosting performance speeds. |
|
Latency |
Delay in a RAM's response time from commands from the MCC is called latency. |
|
Page or Swap File |
Virtual memory set aside by the hard drive that serves as an extension of system RAM. When the system runs out of room on RAM is goes to this virtual memory. Recommended size is 1.5 times the amount of RAM installed. |
|
Disk Thrashing |
When Windows has to access the page file too frequently. Means you need more RAM. |
|
System RAM Recommendations |
32-bit Windows: 2GB to get by 4GB for best results. 64-bit Windows: 4GB to get by. 8GB for solid. 16+GB for processor-intensive work. OSX: 2 GB minimum. Linux: Depends on the distro. |
|
ReadyBoost |
A feature introduced in Vista that allows you to use flash media(USB sticks, memory cards) devices as fast, dedicated virtual memory. 1 device in Vista. Up to 8 in 7 and beyond. Between 1 and 32 GB. |
|
Serial Presence Detect (SPD) |
The SPD chip was added to RAM that stores all the info about the RAM. Your motherboard will detect and automatically setup any DIMM on installation. |
|
Non-Maskable Interrupt (NMI) |
An interruption that the CPU cannot ignore. Causes system to crash Manifests as the propriety crash screen(Blue Screen of Death) in Windows or the pinwheel of death on MAC. |
|
CPU |
Central Processing Unit. AKA a microprocessor. A chip within a computer that carries out the instructions of a computer program by performing the basic arithmetic, logical, control and input/output (I/O) operations |
|
EDB |
External Data Bus. Data and commands between the CPU and RAM flow between the external data bus. |
|
Registers |
The registers provide temporary storage of internal commands and data. |
|
Clock Cycle |
The amount of time between two pulses of a system crystal. Maximum # of clock cycles a CPU can handle is called the Clock Speed. Measured in Hertz (Hz). |
|
Memory. |
Devices that in any way hold ones and zeros that the CPU accesses are known as Memory. RAM is the main example. |
|
Memory Controller Chip (MCC) |
Grabs the contents of any single line of RAM and places the data or command on the EDB. This in turn enables the CPU to act on that code. |
|
Address Bus |
A set of wires that allows the CPU to communicate with the MCC to tell it what line of code to get from RAM. |
|
Throttling |
Making the CPU run more slowly when demand is light. |
|
x86 x64 |
x86 refers to 32-bit OS. x64 refers to 64-bit OS. |
|
Virtualization |
Running more than one operating system at a time. |
|
Parallel Exectution |
Modern CPUs can process multiple commands and parts of commands in parallel pipelines. |
|
Stage |
CPU takes at least 4 stages to complete a command. 1. Fetch: Get the data from the EDB 2. Decode: Figure out what type of command needs to be executed. 3. Exectute: Performs the calculation. 4. Write: Send the data back onto the EDB. |
|
Pipeline |
In the past CPUs had to go through all the stages before start the next. Meaning 3 of the 4 stages were not in use. Now the circuits are organized in a conveyor-belt fashion called a pipeline. |
|
Arithmetic Logic Unit (ALU) or Integer Unit |
Part of the CPU that handles basic math for whole integers. CPU spends most of its work doing this work. |
|
Floating Point Unit (FPU) |
Part of the CPU that handles complex numbers. |
|
Static RAM (SRAM) |
CPUs come with built-in, high speed RAM called SRAM. SRAM preloads as many instructions as possible and keeps copies of already-run instructions and data in case the CPU needs to work on them again, When SRAM is used in this fashion it is called a Cache. |
|
L1, L2, and L3 Cache |
L1 is on the CPU; it is the smallest and quickest caches; the CPU will check L1 first when needed. L2 is bigger and a little slower; will be checked second. L3 is bigger and slower still; will be checked third when needed. |
|
Hyper-Threading |
Generically called Simultaneous Multithreading, effectively turned the CPU into 2 CPUs on 1 chip. Unfortunately, the OS and applications must have been designed to take advantage of the feature. |
|
Multicore Processing |
Combines 2 or more CPUs(Cores) onto a single chip. They divide work independently of the OS, meaning the OS and Apps don't need to be written to specifically handle this. |
|
Graphics Processing Unit (GPU) |
CPUs can have integrated GPUs that enchances the overall performance of the PC, while at the same time reducing energy, size, and cost. However, this is much weaker than having a dedicated GPU installed. |
|
Integrated Memory Controller (IMC) |
Optimizes the flow of information into and out from the CPU. Enables faster control over things like the large L3 caches shared among multiple cores. |
|
Disable Execute Bit |
Enables the CPU to protect certain sections of memory. Stops malicious attacks from getting to essential OS files. |
|
Intel Sockets |
LGA 775: Pertium 4, Celeron, Pentium 4 Extreme Edition, Core 2 Duo, Core 2 Quad, Xeon, and many others. LGA 1156: Core i3/i5/i7, Pentium, Celeron, Xeon. LGA 1155: Core i3/i5/i7, Pentium, Celeron, Xeon LGA 1366:Core i7, Celeron, Xeon LGA 2011: Core i7, Core i7 Extreme Edition, Xeon. LGA 1150: Core i3/i5/i7, Pentium, Celeron, Xeon LGA 1151:Core i3/i5/i7, Pentium, Celeron, Xeon |
|
AMD Sockets |
AM3: 941-pin: Phenom II, Athlon II, Sempron, Opteron. AM3+: 942-pin: FX FM1: 905-pin: A-Series FM2: 904-pin: A-Series FM2+: 906-pin: A-Series G34: 1974-pin: Opteron G32: 1207-pin: Opteron |
|
Land Grid Array (LGA) |
Used by Intel-compatible sockets. Sockets have hundreds of tiny pins that line up with contacts on the bottom of the CPU chip. |
|
Pin Grid Array (PGA) |
Used by AMD-compatible sockets. Sockets have hundreds of tiny holes that line up with pins on the bottom of the CPU chip. |
|
Zero Insertion Force (ZIF) Sockets |
A type of CPU socket that requires no force to insert the CPU. CPU can only be oriented one direction and is inserted with a small lever. |
|
Heat Sink |
A metal part that is attached to the top of the CPU and is used to dissipate the heat generated by the CPU. Often accompanied by a fan to keep the unit cool. |
|
Liquid Cooling |
Runs a liquid, usually water, through a metal block that sits on top of the CPU and absorbs heat. |
|
Thermal Paste |
A compound that is put between the CPU and it's heat sink. Too much or too little compound will cause overheating issues. |
|
Overclocking |
Intentionally running the system at a clock speed higher than what the CPU was rated for. Boosts power, but can damage your system and voids the warranty. |